Professor Ravinder Dahiya from the University of Glasgow will discuss the latest advances, approaches, uses, and future iniatives in microelectronics, including sensing components, electronics on unconventional substrates and 3D surfaces, and ultra-thin systems.
The miniaturization-led advances in microelectronics over 50 years have revolutionized our lives through fast computing and communication. Recent advances in the field are propelled by applications such as robotics, wearable systems, and healthcare through More than Moore technologies. Often, these applications require electronics to conform to 3D surfaces and this calls for new methods to realize devices and circuits on unconventional substrates such as plastics and paper. This lecture will present various approaches (over different time and dimension scales) for obtaining distributed electronics and sensing components on flexible and conformable substrates, especially in context with tactile or electronic skin (e-skin). These approaches range from distributed off-the-shelf electronics, integrated on flexible printed circuit boards to advanced alternatives such as e-skin by printed nanowires, graphene and ultra-thin chips. The technology for such sensitive, flexible and possibly stretchable electronic systems is also the key enabler for numerous emerging fields such as internet of things, smart cities and mobile health. This lecture will also discuss how the flexible electronics research may unfold in the future.
ABOUT THE SPEAKER
Ravinder Dahiya is Professor of Electronics and Nanoengineering and Engineering and Physical Sciences Research Council (EPSRC) Fellow in the School of Engineering at University of Glasgow. He is the Director of Electronic Systems Design Centre (ESDC) and the leader of Bendable Electronics and Sensing Technologies (BEST) group. His group conducts fundamental research on high-mobility materials based flexible electronics and electronic skin, and their application in robotics, prosthetics and wearable systems.
Professor Dahiya has published more than 200 research articles, 4 books (3 at various publication stages), and 11 patents (including 7 submitted). He has given more than 90 invited/plenary talks including a TEDx talk. He has led many international projects including those funded by European Commission, EPSRC, The Royal Society, The Royal Academy of Engineering, and The Scottish Funding Council.
He is Distinguished Lecturer of IEEE Sensors Council and is on the Editorial Boards of Scientific Reports (Nature Group), IEEE Transactions on Robotics and IEEE Sensors Journal. He was the Technical Program Co-Chair (TPC) for IEEE Sensors Conference in 2017 and will continue in this role for the IEEE Sensors Conference in 2018. Professor Dahiya holds EPSRC Fellowship and has previously received Marie Curie Fellowship and Japanese Monbusho Fellowship. He has received several awards, with the most recent being the 2016 IEEE Sensor Council Technical Achievement Award, 2016 Microelectronic Engineering Young Investigator Award (Elsevier) and being included in the Scottish 40UNDER40 list.
Professor Ravinder Dahiya (University of Glasgow)
Institute for Future Environments
- Phone: 3138 9500
- Int. phone: +61 7 3138 9500
- Fax: +61 7 3138 4438
- Postal address:
Institute for Future Environments
GPO Box 2434
Brisbane QLD 4001